Advanced Solderless PCB Connection Solutions
Pressfit technology represents a revolutionary approach to PCB assembly, eliminating
traditional soldering processes through mechanical press-in connections. Using elastic
Eye-of-the-Needle (EON) compliant pins, this technology creates gas-tight, cold-welded
connections that meet stringent international standards including EN 60352-5 and IPC-
9797. Widely adopted in automotive, telecommunications, and industrial applications,
pressfit solutions deliver superior reliability, reduced assembly time, and enhanced
design flexibility.
Pressfit technology represents a revolutionary approach to PCB assembly, eliminating
traditional soldering processes through mechanical press-in connections. Using elastic
Eye-of-the-Needle (EON) compliant pins, this technology creates gas-tight, cold-welded
connections that meet stringent international standards including EN 60352-5 and IPC-
9797. Widely adopted in automotive, telecommunications, and industrial applications,
pressfit solutions deliver superior reliability, reduced assembly time, and enhanced
design flexibility.
What is Pressfit Technology?
Pressfit technology is a solderless connection method that involves inserting specially
designed compliant pins into plated-through-holes (PTH) on printed circuit boards. The
process creates a secure mechanical and electrical connection through controlled
interference fit between the pin's press-fit zone and the PCB hole metallization.
First introduced in the telecommunications industry during the 1970s, pressfit
technology has evolved significantly. The standardization began with DIN 41611-5 in
1984, followed by the comprehensive IEC 60352-5 standard that defines general
requirements, test methods, and practical guidance for press-in connections.
Key Components of Pressfit Systems
-EON (Eye-of-the-Needle) Press-Fit Zone: The elastic press-fit area features a spring-
like design that compresses during insertion, providing optimal balance between
insertion force and long-term retention force.
-Plated Through-Holes (PTH): Precisely drilled and metallized holes in the PCB
designed to specific tolerances to accommodate the press-fit pins.
-Press-Fit Equipment: Automated insertion machines that control pressure, speed, and
positioning to ensure consistent, high-quality connections.
Key Components of Pressfit Systems
-EON (Eye-of-the-Needle) Press-Fit Zone: The elastic press-fit area features a spring-
like design that compresses during insertion, providing optimal balance between
insertion force and long-term retention force.
-Plated Through-Holes (PTH): Precisely drilled and metallized holes in the PCB
designed to specific tolerances to accommodate the press-fit pins.
-Press-Fit Equipment: Automated insertion machines that control pressure, speed, and
positioning to ensure consistent, high-quality connections.
Advantages of Pressfit Technology
Elimination of Thermal Stress
Unlike soldering processes, pressfit assembly operates at room temperature, preventing thermal damage to sensitive components. This cold assembly method protects both the PCB substrate and mounted components from heat-related stress and
deformation.
Superior Reliability and Durability
Pressfit connections demonstrate exceptional reliability in demanding environments.
According to IEC 1709 standards, press-fit connections achieve a fit-rate of 0.005, making them one of the most reliable connection techniques available. The elastic nature of EON pins maintains consistent contact force over time, ensuring stable electrical performance through temperature cycling, vibration, and mechanical stress.
Enhanced Design Flexibility
The absence of soldering requirements provides unprecedented design freedom.
Components can be mounted on either side of the PCB without additional processing costs. This flexibility enables compact designs and allows for component placement in space-constrained applications.
Simplified Assembly Process
Pressfit technology significantly reduces assembly time and complexity:
● No flux application required
● No cleaning processes needed
● No solder defects to manage
● Faster production cycles
● Lower operational costs
Vibration and Mechanical Stress Resistance
The elastic compliance of pressfit pins absorbs vibrations and mechanical shocks that would potentially compromise soldered connections. This characteristic makes pressfit technology particularly valuable in automotive and transportation applications where components experience continuous vibration.
Reworkability and Serviceability
Unlike soldered connections, pressfit assemblies can be removed and reinstalled multiple times without compromising connection integrity. This feature enables field repairs and facilitates prototype development and testing phases.
Available Pressfit Pin Sizes and Specifications
● Insertion Force: 74-91 N
● Extraction Force: 54-73 N
● Recommended PCB Hole: Ø0.60 mm
● Applications: Ultra-compact connectors, miniaturized devices
● Insertion Force: <100 N
● Extraction Force: >20 N
● Recommended PCB Hole: Ø1.0 mm
● Applications: Standard automotive connectors
● Insertion Force: 66-135 N
● Extraction Force: 145-235 N
● Recommended PCB Hole: Ø1.25 mm
● Applications: High-retention applications
● Recommended PCB Hole: Ø1.5 mm – Ø1.8 mm
● Applications: Power modules, high-current applications
EN 60352-5 Qualification and Testing Standards
International Standards Compliance
Pressfit technology adheres to rigorous international standards that ensure reliability
and interoperability:
● IEC/EN 60352-5: Defines requirements for press-in connections, including
dimensional specifications, electrical performance, and mechanical durability
requirements.
● IPC-9797: Automotive-specific standard for press-fit technology, addressing
harsh environment requirements and automotive industry needs.
● GR-1217-CORE: Telecommunications industry standard for press-fit
Qualification Testing Parameters
Contact Resistance Testing
● Maximum change: ΔRc < 0.5 mΩ
● Ensures stable electrical performance throughout product lifecycle
PCB Deformation Analysis
● Maximum hole contour deformation (a max ): < 70 µm
● Minimum plating thickness retention (b min ): > 8 µm
● Maximum outer layer deformation (c max ): < 50 µm
● Verification through microscopic cross-sectioning Rapid
Temperature Change Testing
● Test cycles: 10 cycles minimum
● Temperature range: -40°C to +85°C
● Dwell time: 30 minutes per extreme
● Validates thermal cycling resistance
Climatic Sequence Testing
● High temperature exposure: +85°C for 16 hours
● Humidity exposure: +25°C/+55°C at 90-95% RH
● Low temperature exposure: -40°C for 2 hours
● Simulates real-world environmental conditions
Pressfit Assembly Process and Equipment
Optimal Insertion Parameters
Press-in Speed: Minimum 25 mm/min according to IEC 60352-5. Typical production speeds range from 100-450 mm/min for automated assembly lines. Insufficient speed can lead to increased insertion forces and potential pin deformation.
Insertion
Force Monitoring: Professional press-fit equipment records force and displacement data throughout the insertion cycle, ensuring quality control and process consistency.
Tooling Requirements: Custom press-in tools designed specifically for each connector configuration, featuring proper support structures and clearances for PCB-mounted components.
PCB Design Considerations
Hole Diameter Specifications: Critical parameter requiring precise control. The drill diameter must be specified by the press-pin manufacturer, with copper plating thickness typically 30-50 µm and tin coating approximately 1 µm.
PCB Surface Finishes:
Compatible finishes include:
● Immersion Tin (preferred for automotive applications)
● HAL (Hot Air Leveling)
● HAL Lead-Free
● OSP (Organic Surface Preservative) – requires specific qualification
Base Material Compatibility: Standard FR-4 materials are fully qualified. Materials containing Teflon require special evaluation due to plastic deformation characteristics.
Quality Control and Inspection Methods
Advanced inspection systems utilize optical methods to verify:
● Pin presence in PTH
● Insertion depth accuracy
● Pin alignment and positioning
● Detection of bent or damaged pins
Advanced inspection systems utilize optical methods to verify:
● Pin presence in PTH
● Insertion depth accuracy
● Pin alignment and positioning
● Detection of bent or damaged pins
In-circuit test (ICT) methods validate:
● Contact resistance measurements
● Continuity verification
● Isolation testing
Pressfit vs. Traditional Soldering
| Aspect | Traditional Soldering | Pressfit Technology |
|---|---|---|
| Assembly Temperature | 250-350°C | Room temperature |
| Component Stress | High thermal stress | No thermal stress |
| Process Time | Slower (multiple steps) | Faster (single step) |
| Rework Capability | Limited | Excellent (multiple cycles) |
| Environmental Impact | Lower (no flux/cleaning) | Higher (chemicals required) |
| Vibration Resistance | Good | Excellent |
| Design Flexibility | Moderate | High (double-sided) |
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20-22 voie Gallo Romaine
77860 Quincy-Voisins France
